What is the difference between patch inductors and wound inductors?

With the continuous development of China's information age, electronic components have become particularly important. Today, let's take a look at the difference between stacked inductors and wound inductors.

1. Differences in production processes:

The wire wound chip inductor is based on the traditional production process of wire wound inductors, which transforms the plug-in inductor into a chip packaging, reducing the volume of the inductor and making it more convenient to use.

The SMD laminated inductor is made using multi-layer printing technology and laminated production process.

2. Performance differences:

SMD laminated inductors have good magnetic shielding, high sintering density, and good mechanical strength, but their inductance accuracy and inductance range are not as good as those of wound SMD inductors.

The external winding inductor has advantages such as high Q value, low loss, and can pass through high current.

3. Price difference: The production of stacked inductors is difficult, with high technical requirements, high production costs, and higher prices than wound inductors.

4. Other differences: The heat dissipation of the SMD stack inductor is better than that of the wound SMD inductor. The SMD stack inductor cannot see the wires, and has better resistance to inductance interference, heat dissipation, and installation space saving compared to the SMD winding inductor.

Wound inductors are slightly superior in terms of current resistance and production cost, and have a higher ESR value than stacked inductors.